HFSS15: Best Practices for Accurate and Causal Broad Band Frequency Sweeps

This section presents practices applied in the Finite Element Method in order to extract accurate and causal broad band frequency sweeps when simulating Printed Circuit Boards (PCBs) and interconnects. The importance and treatment of metal traces of finite thickness, accurate DC point, causal material models, causal surface roughness models and deembedding parasitic effects will be discussed and demonstrated by simulating real life problems.

Introduction to Causality Issues for Simulations

Surface Impedance Boundary Condition (SIBC) for Metal Traces of Finite Thickness

Using Causal Material Models

Surface Roughness Modeling

Deembedding Parasitic Lumped Port Effects

References for Accurate and Causal Broad Band Frequency Sweeps